Ribbon Cable Insulation Displacement Mass Termination

Connector Engineering & Design
Connector Technology
Connector Manufacturing Engineering
Connector Business Development
Contact Information
2408C Park Drive
Harrisburg, PA 17110
Phone: 717-540-4330
Fax: 717-540-4339
Email Us

Connector Electrical Simulation


Electrical simulation models the behavior of a high-speed electrical pulse traveling along a conductive path from its source to termination. Descriptive parameters include impedance, inductance, capacitance, and propagation delay. These are then integrated to generate S Parameter and Return Loss predictions versus frequency. These parameters, along with the interconnect SPICE model, may be incorporated into system simulations. Various signal-to-ground ratios are also modeled to predict cross-talk. Simulation software can visually depict the flight path of a traveling source wave relative to adjacent victim lines.


Variables that influence signal quality include connector geometry, materials selection and signal parameters. The ability to accurately define critical parameters and mesh these properties determines the quality of the simulation. Electrical simulation results are then linked to an iterative mechanical design model (prior to prototyping and/or production) thereby reducing cost and time to market.


APEX is experienced with both single-ended and differential models for all types of interconnects and PCB attachment methods, using state-of-the-art electrical and mechanical software.




  • Draw on expertise with electrical interconnections
  • Utilize modeling and simulation experience
  • Employ hands-on ability backed by theoretical knowledge
  • Acquire advantages of state of the art analytical software
  • Use frequency and time domain analysis techniques
  • Retain ability to link to mechanical simulation



  • Predictions of S Parameters and Return Loss
  • Generation of SPICE and HSPICE models
  • Dynamic visualization of electrical signal propagation
  • Quantification of NEXT and FEXT (Cross-talk)
  • Optimization of mechanical geometry
  • Comprehensive documentation



  • Analyzed LGA socket designs
  • Generated TDR simulation of automotive RF connector
  • Optimized impedance characteristics of test PCB
  • Developed SPICE models for two-piece mezzanine connectors
  • Predicted field strength patterns for imbedded antenna
  • Diagnosed and resolved inter-pair skew of SFP connector
  • Compared the performance of competitive card-edge designs