A large fraction of connectors and related components is subjected to joining processes, mostly soldering. Other joining processes that may be less commonly employed in connectors and related components include welding, brazing, and use of organic compounds, both conductive and non-conductive (epoxies, “organic solders”, etc.). Successful joining of connectors usually presents more challenges than the rest of PCB components because of larger size and larger thermal mass. Also, the joining process, besides providing reliable joints, both mechanical and electrical, should not negatively affect the consequent contact performance of connectors.
Lead-free plating and soldering presents many additional problems to already complex and demanding process. Lead-free finishes are generally either less solderable or introduce other problems such as joint embrittlement by gold and tin whisker growth. While a large amount of research data exists for tin-lead solders, the process-applicable research on lead-free soldering is still rather limited.
The experts at APEX have extensive knowledge of soldering processes, including lead-free soldering. Their knowledge extends to other joining techniques such as brazing (e.g. aluminum alloy brazing) and welding (e.g. resistance welding).
- Use extensive combined joining process expertise
- Lower cost of process development
- Improve process reliability
- Prevent product failures
APEX CAN HELP TO PROVIDE:
- Proper material selection
- Process parameters set-up and fixturing
- Process failure analysis
- Balance cost vs. performance
- Resolve compatibility issues
EXAMPLES OF APEX JOINING TECHNOLOGY INVOLVEMENT
- Analyzed failures in miniature coax soldering
- Recommended materials and design changes in lead-free soldering process
- Developed a complete set-up for aluminum alloy brazing process
- Provided a compatible substitute material for lead-free soldering
- Set up parameters and developed fixturing for resistance welding process