Nov 23, 2020
Fretting Corrosion of Tin Contacts — A Growing Problem in the Automotive Industry
Tin and tin-based finishes are less expensive contact finish solution compared to precious metals, but it comes with its own set of problems. This paper is a concise review of the current problems with use of the tin finish contacts in automotive electronics. It briefly describes the background of the issues, and points to potential solutions.
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Mar 25, 2016
CCSI: Connector Crime Scene Investigation
Failure analysis investigation requires at least two ingredients: experts and technical means. This article briefly touches on the current expert situation in the US, particularly the effects of globalization. It also describes some of the technical methods used in failure investigation, starting with simple inspection, often aided by an optical microscope, and progressing to more advanced techniques, such as scanning electron microscopy (SEM) and X-ray radiography. In case of SEM it describes three main modes of this technology – secondary electron imaging (the most common), back-scatter electron imaging, and energy dispersive X-ray analysis. For radiography, it starts with regular high-magnification radiography that allows internal investigation of increasingly smaller parts, and proceeds to a full computer-aided tomography on a small and down to microscopic scale (micro-CT).
Apr 22, 2015
The Basics of Connector Soldering
Many connectors and related components are subject to joining processes, which primarily involve soldering.The quality of these processes can be a key factor in component performance.The article covers basics of soldering, such as conditions necessary for solder to wet the substrate.It discusses interaction of solder with substrate such as substrate dissolution and formation of intermetallic compounds (IMCs).It also touches on soldering process issues related to obtaining adequate solder joint quality, and specific issues common to soldering of connectors versus those inherent to other components.Other stages of the entire manufacturing process prior to soldering could influence solder joint quality, including storage and transportation that can unfavorably affect solderability.In conclusion lead-free soldering is briefly discussed.